4" Precision Polishing Fixture with Vacuum Jig for Faster Thinning and Polishing - EQ-PF-4-1V

4" Precision Polishing Fixture with Vacuum Jig for Faster Thinning and Polishing - EQ-PF-4-1V

4" Precision Polishing Fixture with Vacuum Jig for Faster Thinning and Polishing - EQ-PF-4-1V

SPECIFICATIONS:

Features	Precision Polishing Jig for accurate wafer/substrate polishing and back-thinning 4" Diameter sample holder vacuum chuck to take wafer or substrate up to 4" Vacuum chuck can suck wafer through vacuum pump without wax and make wafer sample mounting clean, faster and flat 2 feet length vacuum tube is included to connect the vacuum pump, which keeps vacuum pressure during jig rotation Thickness control screw fixture with a resolution of 0.005 mm to limit stock remove One digital micrometer is included with a resolution of +/- 1 micron for more accurate control polishing remove Two dead weights are included for adjusting polishing gravity This Polishing fixture can fit with, Unipol 1202 and Unipol 1502 and any precision 12" or larger polishing machine with yoke support to achieve automatic polishing or thinning. Require a vacuum pump with a rate > 70 L/ min. Maximum travel distance: 6.7mm Net Weight: 18 lbs
Product Images	Note: super-hard tungsten alloy is welded on the bottom of the jig for polishing responsible
Application notes	This fixture also can polish < 4" wafer via the blue tape method Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape Then put the 4" blue tape with the wafer to vacuum chunk
Operation Instructions	Please click on here to download how to use this fixture

$944.30

Original: $2,698.00

-65%

4" Precision Polishing Fixture with Vacuum Jig for Faster Thinning and Polishing - EQ-PF-4-1V—

$2,698.00

$944.30

4" Precision Polishing Fixture with Vacuum Jig for Faster Thinning and Polishing - EQ-PF-4-1V

SPECIFICATIONS:

Features	Precision Polishing Jig for accurate wafer/substrate polishing and back-thinning 4" Diameter sample holder vacuum chuck to take wafer or substrate up to 4" Vacuum chuck can suck wafer through vacuum pump without wax and make wafer sample mounting clean, faster and flat 2 feet length vacuum tube is included to connect the vacuum pump, which keeps vacuum pressure during jig rotation Thickness control screw fixture with a resolution of 0.005 mm to limit stock remove One digital micrometer is included with a resolution of +/- 1 micron for more accurate control polishing remove Two dead weights are included for adjusting polishing gravity This Polishing fixture can fit with, Unipol 1202 and Unipol 1502 and any precision 12" or larger polishing machine with yoke support to achieve automatic polishing or thinning. Require a vacuum pump with a rate > 70 L/ min. Maximum travel distance: 6.7mm Net Weight: 18 lbs
Product Images	Note: super-hard tungsten alloy is welded on the bottom of the jig for polishing responsible
Application notes	This fixture also can polish < 4" wafer via the blue tape method Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape Then put the 4" blue tape with the wafer to vacuum chunk
Operation Instructions	Please click on here to download how to use this fixture

Product Information

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Description

SPECIFICATIONS:

Features	Precision Polishing Jig for accurate wafer/substrate polishing and back-thinning 4" Diameter sample holder vacuum chuck to take wafer or substrate up to 4" Vacuum chuck can suck wafer through vacuum pump without wax and make wafer sample mounting clean, faster and flat 2 feet length vacuum tube is included to connect the vacuum pump, which keeps vacuum pressure during jig rotation Thickness control screw fixture with a resolution of 0.005 mm to limit stock remove One digital micrometer is included with a resolution of +/- 1 micron for more accurate control polishing remove Two dead weights are included for adjusting polishing gravity This Polishing fixture can fit with, Unipol 1202 and Unipol 1502 and any precision 12" or larger polishing machine with yoke support to achieve automatic polishing or thinning. Require a vacuum pump with a rate > 70 L/ min. Maximum travel distance: 6.7mm Net Weight: 18 lbs
Product Images	Note: super-hard tungsten alloy is welded on the bottom of the jig for polishing responsible
Application notes	This fixture also can polish < 4" wafer via the blue tape method Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape Then put the 4" blue tape with the wafer to vacuum chunk
Operation Instructions	Please click on here to download how to use this fixture