Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt
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Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt

Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt

    Features:
    • Corning EAGLE XG  Glass Substrates 
      Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) 
    • Dimension:  50.8 mm (+/-0.2mm)  x 0.5 mm(+/-0.05mm)
    • High transmission (75-80 %)
    • Low defect densities
    • Low ohmic values
    • Surface Quality; 60/40
    • Edge : CNC ground
    • Non- effective area: 2.0mm Border
    • Highly transparent
    • LCD and OLED applications
    • Roughness:<5A Rms
    $35.95
    Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt—
    $35.95

    Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt

      Features:
      • Corning EAGLE XG  Glass Substrates 
        Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) 
      • Dimension:  50.8 mm (+/-0.2mm)  x 0.5 mm(+/-0.05mm)
      • High transmission (75-80 %)
      • Low defect densities
      • Low ohmic values
      • Surface Quality; 60/40
      • Edge : CNC ground
      • Non- effective area: 2.0mm Border
      • Highly transparent
      • LCD and OLED applications
      • Roughness:<5A Rms

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      Description

        Features:
        • Corning EAGLE XG  Glass Substrates 
          Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) 
        • Dimension:  50.8 mm (+/-0.2mm)  x 0.5 mm(+/-0.05mm)
        • High transmission (75-80 %)
        • Low defect densities
        • Low ohmic values
        • Surface Quality; 60/40
        • Edge : CNC ground
        • Non- effective area: 2.0mm Border
        • Highly transparent
        • LCD and OLED applications
        • Roughness:<5A Rms