Tungsten (W) Polycrystalline Substrate: 1"x1"x0.5 mm, two sides polished
HomeStore

Tungsten (W) Polycrystalline Substrate: 1"x1"x0.5 mm, two sides polished

Tungsten (W) Polycrystalline Substrate: 1"x1"x0.5 mm, two sides polished

  • Polycrystallline  W ( Tungsten)  substrate
  • Average Grain Size:      10~50 Microns  ( No annealling )
  • Purity:                          99.95%
  • Substrate dimension:     1"x1"x0.5 mm
  • Polishing:                      two sides as cool rolling

Related Product

Metallic Substrate A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

 Film Coater

$68.25

Original: $195.00

-65%
Tungsten (W) Polycrystalline Substrate: 1"x1"x0.5 mm, two sides polished—

$195.00

$68.25

Tungsten (W) Polycrystalline Substrate: 1"x1"x0.5 mm, two sides polished

  • Polycrystallline  W ( Tungsten)  substrate
  • Average Grain Size:      10~50 Microns  ( No annealling )
  • Purity:                          99.95%
  • Substrate dimension:     1"x1"x0.5 mm
  • Polishing:                      two sides as cool rolling

Related Product

Metallic Substrate A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

 Film Coater

Product Information

Shipping & Returns

Description

  • Polycrystallline  W ( Tungsten)  substrate
  • Average Grain Size:      10~50 Microns  ( No annealling )
  • Purity:                          99.95%
  • Substrate dimension:     1"x1"x0.5 mm
  • Polishing:                      two sides as cool rolling

Related Product

Metallic Substrate A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

 Film Coater